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AI Liquid Cooling Revolution: Laser Welding Seizes the Multi-Billion Thermal Market

2026-05-27

Tin tức công ty mới nhất về AI Liquid Cooling Revolution: Laser Welding Seizes the Multi-Billion Thermal Market

With the explosive growth of Artificial Intelligence (AI) and High-Performance Computing (HPC), the demand for GPU computing power in data centers has skyrocketed. Next-generation chips, represented by Nvidia's Blackwell architecture, have seen their Thermal Design Power (TDP) surpass the 1000W mark. Traditional air cooling technologies are struggling to cope with such high-density heat challenges. In this context, liquid cooling technology is becoming an absolute "must-have" for AI infrastructure due to its superior heat dissipation efficiency. As the core component of liquid cooling systems, the manufacturing process of liquid cold plates—especially the application of laser welding technology—is undergoing a profound revolution in precision manufacturing. For laser welding equipment manufacturers, this is not just an opportunity for technological upgrades, but a golden window to capture a share of the multi-billion dollar thermal management market.

Overcoming the Challenge of Highly Reflective Materials: Laser Welding Establishes Process Superiority

Liquid cold plates are typically made of copper and aluminum for their high thermal conductivity. However, these materials have extremely low absorption rates for traditional infrared lasers (less than 5%), which easily leads to spatter, porosity, and incomplete welds during the welding process, severely affecting the sealing and reliability of the liquid cooling system. Recent breakthroughs in laser welding technology have completely shattered this bottleneck. Currently, mainstream industry solutions incorporate wobble welding heads, ring-shaped beam technologies, and AI intelligent closed-loop control systems. These advancements not only effectively expand the beam's action range to accommodate assembly gaps but also boost yield rates to over 99%, achieving micron-level precision control with minimal heat-affected zones.

Even more cutting-edge is the application of green light (515nm wavelength) and blue diode lasers, which have become the "killer app" for conquering highly reflective materials. Compared to traditional infrared lasers, green and blue light increase the absorption rate of copper by over 8 times (reaching 40%-47%). This enables efficient, spatter-free, high-quality deep penetration welding, perfectly meeting the rigorous processing demands of liquid cold plates and micro-channel structures.

Accelerating Industrial Layout: Marching Towards Intelligent and Zero-Defect Manufacturing

Facing the explosion of the liquid cooling market expected by 2026, top global laser enterprises have launched comprehensive technological competitions. HG Laser has introduced intelligent automated laser welding equipment for power battery liquid cold plates, significantly boosting production efficiency through adaptive energy control and real-time AI monitoring. Han's Laser has rolled out full-scenario solutions for liquid cooling components, covering precision connections from cold plates to manifolds. Meanwhile, TRUMPF Group, in collaboration with partners, has introduced Optical Coherence Tomography (OCT) 3D sensing technology, enabling real-time monitoring and quality traceability of weld seam depth.

Looking ahead, the development of laser welding in the liquid cooling field will present three major trends: First, innovation in light source technology, where green/blue light and ultrafast lasers will further solve the brittleness issues in joining dissimilar materials (such as copper to stainless steel). Second, extreme process intelligence, where AI systems integrated with infrared thermal imaging and spectral monitoring will become standard, ensuring a "zero-leakage" standard during mass production. Third, expansion into more complex packaging fields, such as using ultrafast lasers for Through Glass Via (TGV) micro-drilling on glass substrates, providing key support for the thermal management and interconnection of next-generation 3D-stacked AI chips.

Driven by the dual forces of AI computing power and green energy efficiency, laser welding technology is evolving from a simple processing tool into a core engine that safeguards the safety and performance of the computing foundation, pushing the entire thermal management industry toward greater efficiency and precision.

If you are looking for advanced laser welding equipment capable of solving the pain points of welding highly reflective materials and meeting the mass production demands of liquid cold plates, welcome to contact Hailei Laser to obtain a professional, customized solution.

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