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LaserCut Software Semiconductor ceramic laser cutting and drilling machine optimized for DXF format enabling accurate laser processing

LaserCut Software Semiconductor ceramic laser cutting and drilling machine optimized for DXF format enabling accurate laser processing

semiconductor ceramic laser cutting machine

ceramic laser drilling machine DXF format

accurate laser processing ceramic cutting

Markenname:

Hailei Laser

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Einzelheiten zum Produkt
Cw Output Mode:
Pulse Selectable
Powersupply:
220V/50Hz
Working Mode:
120W
Operating Software:
CypCut
Software:
LaserCut
Laser Minimum Spot:
40um
Worktable Size:
1500mm X 3000mm
Machinedimensions:
2000mm X 1500mm X 1400mm
Hervorheben:

semiconductor ceramic laser cutting machine

,

ceramic laser drilling machine DXF format

,

accurate laser processing ceramic cutting

Zahlungs- und Versandbedingungen
Beschreibung des Produkts
Product Description: The Ceramic Laser Cutting Machine is a state-of-the-art semiconductor ceramic laser cutting and drilling machine designed to meet the precise and demanding needs of modern manufacturing processes. With dimensions of 1200mm X 1200mm X 1500mm, this compact yet powerful machine is engineered to deliver exceptional performance while maintaining a small footprint, making it ideal for various industrial environments. As a leading ceramic laser cutting mac

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