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LaserCut Software Semiconductor ceramic laser cutting and drilling machine optimized for DXF format enabling accurate laser processing

LaserCut Software Semiconductor ceramic laser cutting and drilling machine optimized for DXF format enabling accurate laser processing

semiconductor ceramic laser cutting machine

ceramic laser drilling machine DXF format

accurate laser processing ceramic cutting

브랜드 이름:

Hailei Laser

저희와 연락
인용 을 요청 하십시오
제품 세부 정보
Cw Output Mode:
Pulse Selectable
Powersupply:
220V/50Hz
Working Mode:
120W
Operating Software:
CypCut
Software:
LaserCut
Laser Minimum Spot:
40um
Worktable Size:
1500mm X 3000mm
Machinedimensions:
2000mm X 1500mm X 1400mm
강조하다:

semiconductor ceramic laser cutting machine

,

ceramic laser drilling machine DXF format

,

accurate laser processing ceramic cutting

지불 및 배송 조건
제품 설명
Product Description: The Ceramic Laser Cutting Machine is a state-of-the-art semiconductor ceramic laser cutting and drilling machine designed to meet the precise and demanding needs of modern manufacturing processes. With dimensions of 1200mm X 1200mm X 1500mm, this compact yet powerful machine is engineered to deliver exceptional performance while maintaining a small footprint, making it ideal for various industrial environments. As a leading ceramic laser cutting mac

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개인정보 보호 정책 중국 좋은 품질 QCW 파이버 레이저 공급자. 저작권 2024-2026 Shenzhen Hailei Laser Technology Co., Ltd. 모든 권리는 보호됩니다.