logo
家へ > 製品 > レーザー切断機 >
LaserCut Software Semiconductor ceramic laser cutting and drilling machine optimized for DXF format enabling accurate laser processing

LaserCut Software Semiconductor ceramic laser cutting and drilling machine optimized for DXF format enabling accurate laser processing

semiconductor ceramic laser cutting machine

ceramic laser drilling machine DXF format

accurate laser processing ceramic cutting

ブランド名:

Hailei Laser

連絡してください
引金 を 求め て ください
製品詳細
Cw Output Mode:
Pulse Selectable
Powersupply:
220V/50Hz
Working Mode:
120W
Operating Software:
CypCut
Software:
LaserCut
Laser Minimum Spot:
40um
Worktable Size:
1500mm X 3000mm
Machinedimensions:
2000mm X 1500mm X 1400mm
ハイライト:

semiconductor ceramic laser cutting machine

,

ceramic laser drilling machine DXF format

,

accurate laser processing ceramic cutting

支払いと送料の条件
製品説明
Product Description: The Ceramic Laser Cutting Machine is a state-of-the-art semiconductor ceramic laser cutting and drilling machine designed to meet the precise and demanding needs of modern manufacturing processes. With dimensions of 1200mm X 1200mm X 1500mm, this compact yet powerful machine is engineered to deliver exceptional performance while maintaining a small footprint, making it ideal for various industrial environments. As a leading ceramic laser cutting mac

問い合わせを直接私たちに送ってください.

プライバシーポリシー 中国 良質 QCWファイバーレーザー 提供者 著作権 2024-2026 Shenzhen Hailei Laser Technology Co., Ltd. すべての権利は保護されています.